The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
balun circuit manufactured by integrate passive device process | 24 | 2008 |
semiconductor package and manufacturing method thereof | 23 | 2008 |
substrate having single patterned metal layer, and package applied with the substrate , … 🛈 | 21 | 2009 |
disinfecting / sterilising machine for endoscopes | 17 | 2012 |
wafer and semiconductor package | 16 | 2008 |
advanced quad flat non-leaded package and manufacturing method thereof | 16 | 2009 |
semiconductor package and process for fabricating same | 15 | 2009 |
chip package and manufacturing method thereof | 13 | 2008 |
semiconductor device packages with electromagnetic interference shielding | 12 | 2008 |
substrate for semiconductor package and process for manufacturing | 12 | 2012 |