The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
solder alloy, solder composition, solder paste and electronic circuit board | 30 | 2014 |
solder alloy, solder paste, and electronic circuit board | 17 | 2012 |
solder alloy, solder paste, and electronic circuit board | 15 | 2012 |
flux and solder paste | 14 | 2012 |
solder paste | 14 | 2009 |
flux for solder paste, and solder paste | 14 | 2009 |
heat exchanger tube, heat exchanger, and brazing paste | 13 | 2014 |
fine metal particle dispersant, fine metal particle dispersed liquid, and cured film | 13 | 2013 |
aqueous composition for aluminum brazing | 12 | 2013 |
brazing composition, tube for heat exchanger, and heat exchanger | 12 | 2012 |