The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
liquid sealing material and electronic component using same | 17 | 2012 |
total solid rechargeable battery | 17 | 2006 |
methods of treating copper surfaces for enhancing adhesion to organic substrates for useā¦ 🛈 | 16 | 2010 |
electroconductive paste and method for producing crystalline silicon solar battery | 13 | 2013 |
electroconductive paste | 13 | 2012 |
metal particles and manufacturing method for same | 13 | 2010 |
underfill material and method for mounting electronic component | 12 | 2009 |
underfill for high density interconnect flip chips | 12 | 2009 |
glass frit | 11 | 2013 |
photovoltaic apparatus | 10 | 2012 |