How many patents does
Nippon Micrometal Corporation have?
patents
513
families
64
granted
135
applications
378
JP
106
US
76
KR
55
EP
52
CN
46
WO
45
RoW
133
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The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
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Nippon Micrometal Corporation
Top ten assignees appearing on patents
2009 - 2018
Nippon Micrometal Corporation
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| bonding wire for semiconductor device | 58 | 2015 |
| bonding wire for semiconductor device | 28 | 2015 |
| bonding wire for semiconductor device | 26 | 2015 |
| semiconductor device bonding wire and wire bonding method | 26 | 2007 |
| semiconductor device bonding wire | 24 | 2015 |
| bonding wire for semiconductor devices | 20 | 2007 |
| bonding wire for semiconductor device | 19 | 2015 |
| bonding wire for use with semiconductor devices and method for manufacturing said bondin… 🛈 | 18 | 2014 |
| bonding wire for semiconductor device | 17 | 2014 |
| copper alloy bonding wire for semiconductor | 16 | 2009 |