The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
a circuit board | 8 | 2007 |
packaging substrate structure and method for manufacturing the same | 7 | 2007 |
method of fabricating a circuit board structure | 7 | 2009 |
packaging substrate and fabrication method thereof | 7 | 2009 |
packaging substrate with conductive structure | 6 | 2007 |
packaging substrate with embedded semiconductor component and method for fabricating the… 🛈 | 6 | 2008 |
package structure | 6 | 2008 |
method for fabricating printed circuit board having capacitance components | 5 | 2008 |
method for fabricating packaging substrate | 5 | 2009 |
circuit board having semiconductor chip embedded therein | 5 | 2008 |