The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for forming substrate with insulating buried layer | 8 | 2009 |
method for preparing semiconductor substrate with insulating buried layer by gettering p… 🛈 | 7 | 2010 |
manufacture technology of superstructure ldmos structure on soi capable of completely el… 🛈 | 5 | 2010 |
method for preparing high migration rate dual channel material based on soi substrate | 5 | 2011 |
method for preparing low-warpage semiconductor substrate | 4 | 2013 |
soi cmo device with vertical grid structure | 4 | 2009 |
semiconductor substrate with low warping degree and manufacturing method of semiconducto… 🛈 | 3 | 2013 |
method for preparing semiconductor substrate with smooth edges | 3 | 2013 |
method for preparing substrate with uniform-thickness device layer | 2 | 2011 |
preparation method for mixed crystal material and semiconductor element prepared from sa… 🛈 | 2 | 2009 |