The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
structure of via hole of electrical circuit board | 12 | 2012 |
bundled flexible flat circuit cable | 10 | 2009 |
flexible circuit cable with at least two bundled wire groups | 9 | 2012 |
penetration and assembly structure for flexible circuit board with hinge assembly | 8 | 2013 |
bundled flexible circuit board based flat cable with water resistant section | 8 | 2010 |
bundled flexible cable with water resistant structure | 8 | 2010 |
method and structure of penetration and combination for flexible circuit board with hing… 🛈 | 8 | 2013 |
attenuation reduction grounding structure for differential-mode signal transmission line… 🛈 | 7 | 2013 |
flexible circuit board with planarized cover layer structure | 7 | 2013 |
flexible printed circuit board with waterproof structure | 7 | 2010 |