The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
light emitting diode encapsulating structure and manufacturing method thereof | 13 | 2012 |
light-emitting diode module and manufacturing method thereof | 9 | 2012 |
light-emitting diode and manufacturing method thereof | 9 | 2012 |
method of fabricating photoelectric device of group iii nitride semiconductor and struct… 🛈 | 9 | 2008 |
lead frame and light emitting diode package having the same | 9 | 2012 |
led and method for manufacturing the same | 8 | 2011 |
led package and led die | 8 | 2014 |
light-emitting diode and manufacturing method thereof | 8 | 2011 |
light-emitting diode package and method for manufacturing the same | 8 | 2011 |
light emitting diode die and manufacturing method thereof | 8 | 2014 |