The report contains ten-year analysis with the following sections
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asm technology singapore | 31 |
asm tech singapore | 1 |
microbonds | 1 |
asm technology singapore | 91 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
a molding press and a platen for a molding press | 16 | 2014 |
method of dicing thin semiconductor substrates | 13 | 2014 |
automatic wire tail adjustment system for wire bonders | 12 | 2011 |
apparatus and method for locating a plurality of placement positions on a carrier object | 12 | 2012 |
method of radiatively grooving a semiconductor substrate | 12 | 2013 |
optical device molding system | 12 | 2008 |
apparatus for mounting a transducer in a wire bonder | 11 | 2012 |
method and device for cutting wafers | 11 | 2015 |
an apparatus and method of using an imaging device for adjustment of at least one handli… 🛈 | 11 | 2013 |
die bonding apparatus comprising an inert gas environment | 11 | 2015 |