The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
high power light emitting diode module package structure | 106 | 2008 |
hybrid wiring board with built-in stopper, interposer and build-up circuitry | 36 | 2012 |
method of making stackable semiconductor assembly with bump/flange heat spreader and dua… 🛈 | 35 | 2010 |
method for making copper-core layer multi-layer encapsulation substrate | 19 | 2007 |
method of making thermally enhanced wiring board having isolator incorporated therein | 18 | 2014 |
package-on-package semiconductor assembly having bottom device confined by dielectric re… 🛈 | 16 | 2015 |
thermally enhanced semiconductor assembly with three dimensional integration and method … 🛈 | 14 | 2015 |
wiring board with dual wiring structures integrated together and method of making the sa… 🛈 | 10 | 2014 |
semiconductor package with package-on-package stacking capability and method of manufact… 🛈 | 8 | 2013 |
semiconductor device with face-to-face chips on interposer and method of manufacturing t… 🛈 | 8 | 2013 |