The report contains ten-year analysis with the following sections
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canon machinery | 214 |
advantest corporation | 8 |
eagle industry company | 6 |
denso corporation | 3 |
uacj corporation | 3 |
hamamatsu photonics | 2 |
honda, tomohisa | 1 |
canon machinery | 36 |
eagle industry company | 1 |
canon machinery | 1 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
production device, production method, test apparatus and integrated circuit package | 9 | 2009 |
semiconductor manufacturing device | 7 | 2009 |
substrate conveyance method and substrate conveyance device | 7 | 2012 |
mechanical seal sliding member, and mechanical seal | 7 | 2008 |
suction device | 6 | 2009 |
coating apparatus and coating method | 6 | 2009 |
verfahren zum verlöten von blechmaterial und wärmetauscher | 5 | 2013 |
oxygen partial-pressure control unit and method of gas supply | 5 | 2006 |
chip peeling method, chip peeling apparatus and semiconductor device manufacturing method | 5 | 2008 |
fixing device and fixing method | 5 | 2009 |