How many patents does
China Wafer Level Csp have?
patents
360
families
163
granted
82
applications
278
CN
208
US
54
WO
28
KR
21
JP
11
RoW
38
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The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
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patent families
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China Wafer Level Csp
Top ten assignees appearing on patents
China Wafer Level Csp
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| fingerprint recognition chip packaging structure and packaging method | 9 | 2014 |
| fingerprint recognition chip packaging structure and packaging method | 8 | 2014 |
| packaging structure and packaging method | 8 | 2015 |
| fingerprint recognition chip packaging structure and packaging method | 8 | 2014 |
| packaging method and package structure for image sensing chip | 7 | 2015 |
| image sensing chip packaging structure and packaging method | 7 | 2015 |
| packaging method and package structure for image sensing chip | 7 | 2015 |
| chip packaging method and package structure | 7 | 2014 |
| wafer-level chip package structure and packaging method | 7 | 2014 |
| semiconductor chip packaging structure and packaging method thereof | 6 | 2015 |