How many patents does
Chipbond Technology Corporation have?
patents
407
families
176
granted
130
applications
277
US
94
CN
84
JP
29
KR
23
RoW
177
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The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
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Chipbond Technology Corporation
Top ten assignees appearing on patents
Chipbond Technology Corporation
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| semiconductor structure | 11 | 2013 |
| flexible substrate | 10 | 2015 |
| wafer dicing method | 9 | 2016 |
| flexible substrate | 9 | 2014 |
| semiconductor package structure having hollow chamber and bottom substrate and package p… 🛈 | 9 | 2015 |
| process for manufacturing semiconductor package having hollow chamber | 9 | 2015 |
| substrate with bump structure and manufacturing method thereof | 9 | 2014 |
| semiconductor manufacturing process and structure thereof | 8 | 2012 |
| method of photoresist strip | 7 | 2014 |
| semiconductor structure | 7 | 2013 |