The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
manufacturing process for a quad flat non-leaded chip package structure | 14 | 2005 |
multi-chip package structure, wafer level chip package structure and manufacturing proce… 🛈 | 7 | 2015 |
packaging method involving rearrangement of dice | 7 | 2007 |
multi-chip package structure having blocking structure, wafer level chip package structu… 🛈 | 7 | 2015 |
die rearrangement package structure using layout process to form a compliant configurati… 🛈 | 6 | 2007 |
chip package structure and the method thereof with adhering the chips to a frame and for… 🛈 | 6 | 2008 |
chip package structure and manufacturing method thereof | 5 | 2015 |
fabricating process of a chip package structure | 5 | 2005 |
dice rearrangement package structure using layout process to form a compliant configurat… 🛈 | 5 | 2007 |
chip package without core and stacked chip package structure | 5 | 2005 |