The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
synthetic resin hollow body | 21 | 2006 |
substrate for stealth dicing film, film for stealth dicing, and method for manufacturing… 🛈 | 17 | 2011 |
pressure-sensitive adhesive film or sheet | 12 | 2007 |
tacky resin composition and pressure-sensitive adhesive film or sheet | 12 | 2008 |
laminate film, and film for use in production of semiconductor comprising same | 12 | 2010 |
resin pellet and method for producing the same | 12 | 2009 |
encapsulating material for solar cell | 11 | 2004 |
polymer composition | 11 | 2008 |
resin pellet cleaning method | 11 | 2008 |
resin molding apparatus, resin molding method, and resin container | 10 | 2008 |