The report contains ten-year analysis with the following sections
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ev group e. thallner | 888 |
ev group | 19 |
rhodia operations | 9 |
ev group e thallner gmbh? | 1 |
ev group w. thallner | 1 |
ev group e. thallner | 4 |
ev group | 1 |
ev group e. thallner | 138 |
ev group | 1 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for permanently connecting two metal surfaces | 48 | 2010 |
accommodating device for retaining wafers | 31 | 2010 |
method for the permanent bonding of wafers | 26 | 2011 |
chuck that can be coupled in an automated manner | 26 | 2010 |
bendable carrier mounting, device and method for releasing a carrier substrate | 20 | 2011 |
measuring device and method for measuring layer thicknesses and defects in a wafer stack | 19 | 2010 |
device for aligning two substrates | 18 | 2009 |
method and device for permanently bonding wafers | 16 | 2012 |
apparatus and method for bonding substrates | 16 | 2011 |
receptacle device, device and method for handling substrate stacks | 16 | 2013 |