The report contains ten-year analysis with the following sections
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hanmisemiconductor company | 327 |
spo | 4 |
hanmisemiconductor company | 57 |
hanmisemiconductor company | 6 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for aligning semiconductor materials | 9 | 2010 |
semiconductor strip sawing apparatus | 9 | 2013 |
flip chip bonding apparatus | 8 | 2012 |
method for generating laser beam irradiation trajectory | 8 | 2009 |
flip chip bonding apparatus and flip chip bonding method | 7 | 2013 |
selecting and supplying apparatus for molding tablet | 7 | 2008 |
vision inspection device | 6 | 2016 |
method for vision inspecting semiconductor packages | 6 | 2010 |
flip chip bonding device | 5 | 2013 |
method of inspecting printed circuit board for semiconductor package | 5 | 2012 |