The report contains ten-year analysis with the following sections
contact us for pricing
Check out our sample pages |
Many companies now available
Search to find companies of interest
read summary of their published patent
the company report contains more information
jiangyin changdian advanced packag… 🛈 | 200 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for packaging low-k chip | 6 | 2011 |
led packaging structure | 3 | 2013 |
wafer level fan-out chip packaging method | 2 | 2009 |
method for manufacturing wafer-level patch panel | 2 | 2011 |
led packaging structure and wafer level packaging method thereof | 2 | 2014 |
three-dimensional laminated packaging structure and packaging method thereof | 2 | 2015 |
wafer-level packaging method of semiconductor device | 2 | 2014 |
tsv interposer structure and packaging method thereof | 2 | 2014 |
low-cost led packaging structure and wafer-level packaging method thereof | 2 | 2014 |
wafer-level led packaging method | 2 | 2012 |