How many patents does
Jiangyin Changdian Advanced Packaging Company have?

patents
220
families
175
granted
39
applications
181
CN
213
US
4
WO
3

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The report contains ten-year analysis with the following sections

  • patent filing analysis
  • worldwide filing analysis
  • patent family analysis
  • application analysis
  • granted analysis
  • classification analysis
  • citation analysis

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Jiangyin Changdian Advanced Packaging Company
Top ten assignees appearing on patents

Jiangyin Changdian Advanced Packaging Company
The top ten patent families are

Title of patent family
(most common patent title)
Family
members
Filing
year
method for packaging low-k chip 6 2011
led packaging structure 3 2013
wafer level fan-out chip packaging method 2 2009
method for manufacturing wafer-level patch panel 2 2011
led packaging structure and wafer level packaging method thereof 2 2014
three-dimensional laminated packaging structure and packaging method thereof 2 2015
wafer-level packaging method of semiconductor device 2 2014
tsv interposer structure and packaging method thereof 2 2014
low-cost led packaging structure and wafer-level packaging method thereof 2 2014
wafer-level led packaging method 2 2012