The report contains ten-year analysis with the following sections
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kinsus interconnect technology cor… 🛈 | 217 |
group up industrial company | 4 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
compound carrier board structure of flip-chip chip-scale package and manufacturing metho… 🛈 | 6 | 2013 |
laminate circuit board with a multi-layer circuit structure | 4 | 2012 |
improved structure of magnetic actuation coil | 4 | 2014 |
magnetomotive force coil structure | 4 | 2015 |
carrier structure with magnetic induction coil and soft plate | 4 | 2015 |
manufacturing method of landless multilayer circuit board | 3 | 2016 |
method of manufacturing a laminate circuit board with a multilayer circuit structure | 3 | 2012 |
multi-layer circuit board | 3 | 2016 |
method for fabricating an interlayer conducting structure of an embedded circuitry | 3 | 2009 |
electromagnetic-interference shielding device | 3 | 2017 |