The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
electrical connection structure of lamp cap | 9 | 2014 |
electrical connection structure of lamp cap | 5 | 2015 |
led (light-emitting diode) light source packaging structure | 2 | 2013 |
led lamp heat dissipation structure | 2 | 2015 |
cooling led lamp with vibration piece | 2 | 2014 |
led lighting device | 2 | 2015 |
installation structure of light source panel of led (light-emitting diode) lamp | 2 | 2014 |
led chip packaging method and led packaging structure using same | 2 | 2014 |
automatic led (light emitting diode) assembling device and led lamp assembling method ut… 🛈 | 2 | 2014 |
flip led chip packaging method and flip led chip using packaging method | 2 | 2013 |