The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
three-dimensional wiring board production method, three-dimensional wiring board, and su… 🛈 | 22 | 2015 |
process for forming metal film, and product equipped with metal film | 14 | 2010 |
surface treatment method, surface treatment agent, and novel compound | 14 | 2012 |
substrate manufacturing method | 13 | 2011 |
printed circuit board | 13 | 2014 |
component-embedded substrate and method for manufacturing same | 12 | 2013 |
method for manufacturing substrate with built-in component, and substrate with built-in … 🛈 | 12 | 2010 |
substrate with built-in component and method for manufacturing substrate with built-in c… 🛈 | 12 | 2010 |
printed substrate manufacturing method and printed substrate employing same | 12 | 2010 |
method for manufacturing component-embedded substrate, and component-embedded substrate | 12 | 2013 |