The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
fan-out high-density packaging methods and structures | 7 | 2011 |
packaging structure | 5 | 2011 |
method for reinforcing conductor soldering point of semiconductor device | 5 | 2014 |
chip packaging structure | 5 | 2012 |
packaging method | 5 | 2011 |
semiconductor device | 5 | 2012 |
semiconductor packaging structure | 5 | 2012 |
system-level packaging methods and structures | 5 | 2011 |
3d system-level packaging methods and structures | 5 | 2011 |
method and structure for wafer-level packaging | 5 | 2014 |