The report contains ten-year analysis with the following sections
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napra company | 198 |
napura | 19 |
toyoda gosei company | 2 |
napula corporation | 1 |
napra company | 5 |
napula corporation | 1 |
napura | 1 |
napra company | 20 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
electronic device, conductive composition, metal filling apparatus, and electronic devic… 🛈 | 16 | 2009 |
semiconductor substrate, eletronic device and method for manufacturing the same | 13 | 2011 |
electronic device and manufacturing method therefor | 12 | 2010 |
light-emitting device and method for manufacturing the same | 12 | 2010 |
metal particles having intermetallic compound nano-composite structure crystal | 11 | 2015 |
method for filling metal into fine space | 11 | 2008 |
substrate for electronic device and electronic device | 10 | 2011 |
filling material and filling method using the same | 10 | 2010 |
multi-layer preform sheet | 9 | 2016 |
insulating paste, electronic device and method for forming insulator | 9 | 2012 |