The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
manufacturing method of package-on-package structure | 15 | 2016 |
testing device and testing method | 7 | 2015 |
fan-out chip package with dummy pattern and its fabricating method | 6 | 2015 |
chip package structure and manufacturing method thereof | 6 | 2016 |
stacked chip package structure and manufacturing method thereof | 6 | 2016 |
package structure and manufacturing method thereof | 5 | 2016 |
universal test platform and test method thereof | 5 | 2015 |
wafer level chip scale package having continuous through hole via configuration and fabr… 🛈 | 5 | 2016 |
substrate and package with micro bga configuration | 4 | 2009 |
package structure and manufacturing method thereof | 4 | 2015 |