The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor structure | 11 | 2013 |
flexible substrate | 10 | 2015 |
wafer dicing method | 9 | 2016 |
flexible substrate | 9 | 2014 |
semiconductor package structure having hollow chamber and bottom substrate and package p… 🛈 | 9 | 2015 |
process for manufacturing semiconductor package having hollow chamber | 9 | 2015 |
substrate with bump structure and manufacturing method thereof | 9 | 2014 |
semiconductor manufacturing process and structure thereof | 8 | 2012 |
method of photoresist strip | 7 | 2014 |
semiconductor structure | 7 | 2013 |