The report contains ten-year analysis with the following sections
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chipmos technologies | 35 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
manufacturing process for a quad flat non-leaded chip package structure | 14 | 2005 |
thermally enhanced electronic package | 13 | 2010 |
semiconductor structure and manufacturing method thereof | 10 | 2013 |
semiconductor structure and manufacturing method thereof | 10 | 2013 |
method for manufacturing packaging structure | 8 | 2009 |
chip package structure and manufacturing method thereof | 8 | 2014 |
semiconductor structure and manufacturing method thereof | 8 | 2013 |
chip package structure | 8 | 2013 |
multi-chip stack package structure | 8 | 2010 |
multi-chip package structure having blocking structure, wafer level chip package structu… 🛈 | 7 | 2015 |