The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor device bonding wire and wire bonding method | 26 | 2007 |
bonding wire for semiconductor devices | 20 | 2007 |
copper alloy bonding wire for semiconductor | 16 | 2009 |
bonding wire for semiconductor | 15 | 2009 |
stainless steel foil for a flexible display | 15 | 2008 |
silicon refining equipment and method for refining silicon | 14 | 2012 |
steel structure reinforcement method and reinforcement body, and material for forming el… 🛈 | 13 | 2010 |
insulating film-coated metal foil | 13 | 2011 |
silicon refining device | 13 | 2012 |
bonding wire for semiconductor device | 12 | 2008 |