The report contains ten-year analysis with the following sections
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samtec | 11 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
transceiver and interface for ic package | 37 | 2011 |
methods for determining receiver coupling efficiency, link margin, and link topology in … 🛈 | 18 | 2014 |
via structure for transmitting differential signals | 16 | 2011 |
direct-attach connector | 13 | 2013 |
method for approximating remaining lifetime of active devices | 10 | 2014 |
connector with secure wafer retention | 10 | 2013 |
contact with anti-rotation elements and solder flow abatement | 9 | 2013 |
connector assembly | 9 | 2014 |
transporting data and auxiliary signals over an optical link | 9 | 2011 |
filling materials and methods of filling through holes of a substrate | 9 | 2016 |