The report contains ten-year analysis with the following sections
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toshiba kikai | 76 |
marubun corporation | 10 |
ulvac | 10 |
tokyo ohka kogyo company | 10 |
riken corporation | 10 |
hsp technologies | 3 |
teijin | 2 |
noda, saburo | 1 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
semiconductor light-emitting element and production method | 15 | 2013 |
method of forming micropattern, die formed by this method of forming micropattern, trans… 🛈 | 15 | 2007 |
deep ultraviolet led and method for manufacturing same | 14 | 2014 |
jig for holding thin cylindrical work, method for processing thin cylindrical work, and … 🛈 | 14 | 2009 |
molding apparatus, production apparatus of semi-solidified metal, production method of s… 🛈 | 13 | 2013 |
microscopic geometry cutting device and microscopic geometry cutting method | 13 | 2007 |
molding apparatus, method of molding, and molded products | 12 | 2014 |
method for producing transparent resin composition | 12 | 2013 |
molding device and molding method | 12 | 2012 |
deep ultraviolet led and method for manufacturing same | 12 | 2015 |