The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
package structure having mems element | 10 | 2010 |
packaging substrate and semiconductor package | 9 | 2012 |
semiconductor device | 8 | 2013 |
carrier-free semiconductor package | 8 | 2011 |
semiconductor package and fabrication method thereof | 8 | 2012 |
semiconductor package, and interposer structure of the semiconductor package | 8 | 2012 |
semiconductor package and fabrication method thereof | 8 | 2012 |
semiconductor package structure | 8 | 2009 |
semiconductor package having electrical connecting structures and fabrication method the… 🛈 | 8 | 2009 |
carrier, semiconductor package and fabrication method thereof | 8 | 2012 |