How many patents does
Stats Chippac have?
patents
4,182
families
1,105
granted
1,979
applications
2,203
US
2,984
KR
209
CN
174
JP
18
EP
4
WO
2
RoW
791
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The report contains ten-year analysis with the following sections
- patent filing analysis
- worldwide filing analysis
- patent family analysis
- application analysis
- granted analysis
- classification analysis
- citation analysis
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Stats Chippac
Top ten assignees appearing on patents
2009 - 2018
| stats chippac | 3457 |
| chippac | 35 |
| stats chippac (shanghai) | 9 |
| stats chipac | 4 |
| st assembly test services | 3 |
| stat chippac | 2 |
| stats chippac(shanghai)ltd | 1 |
| sheets wager package | 1 |
| stars chippac | 1 |
| stats chicpac | 1 |
2009
| stats chippac | 283 |
| chippac | 7 |
| sheets wager package | 1 |
| st assembly test services | 1 |
| stats chicpac | 1 |
| stats chipac | 1 |
2018
| stats chippac | 91 |
Stats Chippac
The top ten patent families are
|
Title of patent family (most common patent title) |
Family members |
Filing year |
|---|---|---|
| bump-on-lead flip chip interconnection | 53 | 2003 |
| through-hole via on saw streets | 40 | 2007 |
| semiconductor device and method of forming dual-sided interconnect structures in fo-wlcsp | 33 | 2012 |
| semiconductor device and method of forming interconnect structure for encapsulated die h… 🛈 | 29 | 2007 |
| semiconductor method and device of forming a fan-out pop device with pwb vertical interc… 🛈 | 19 | 2012 |
| semiconductor device and method of forming a vertical interconnect structure for 3-d fo-… 🛈 | 17 | 2008 |
| semiconductor device and method of depositing encapsulant along sides and surface edge o… 🛈 | 17 | 2012 |
| drop-mold conformable material as an encapsulation for an integrated circuit package sys… 🛈 | 16 | 2007 |
| semiconductor device and method of forming reconstituted wafer with larger carrier to ac… 🛈 | 16 | 2011 |
| semiconductor device and method of dual-molding die formed on opposite sides of build-up… 🛈 | 15 | 2009 |