The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
substrate structure and manufacturing method thereof | 12 | 2014 |
circuit structure and manufacturing method thereof | 12 | 2011 |
heat dissipation plate | 11 | 2013 |
package carrier and manufacturing method thereof | 10 | 2011 |
package substrate and manufacturing method thereof | 10 | 2015 |
substrate structure and manufacturing method thereof | 9 | 2014 |
package carrier and manufacturing method thereof | 9 | 2011 |
package structure and manufacturing method thereof | 9 | 2011 |
circuit substrate and manufacturing method thereof | 9 | 2009 |
package structure and manufacturing method thereof | 9 | 2011 |