The report contains ten-year analysis with the following sections
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suess microtec lithography | 300 |
suss microtec | 35 |
alion | 2 |
suss microtec lithograph | 1 |
suss microtee lithography | 1 |
suss microtec | 5 |
suess microtec lithography | 2 |
suess microtec lithography | 58 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
improved apparatus for temporary wafer bonding and debonding | 22 | 2009 |
apparatus and method for aligning and centering wafers | 19 | 2013 |
apparatus, system, and method for handling aligned wafer pairs | 18 | 2015 |
debonding temporarily bonded semiconductor wafers | 17 | 2011 |
chuck, in particular for use in a mask aligner | 15 | 2013 |
method for coating a substrate | 13 | 2015 |
debonding equipment and methods for debonding temporary bonded wafers | 11 | 2009 |
method and device for active wedge error compensation between two objects that can be po… 🛈 | 11 | 2010 |
method and device for curing at least in part a photoresist applied to a substrate | 11 | 2015 |
spacer displacement device for a wafer illumination unit and wafer illumination unit | 11 | 2015 |