The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
connection method, connection structure, and electronic device | 12 | 2009 |
electrode structure, wiring body, adhesive connection structure, electronic device, and … 🛈 | 9 | 2009 |
adhesive resin composition, laminate using same, and flexible printed wiring board | 8 | 2009 |
adhesive resin compositions, and laminates and flexible printed wiring boards using same | 7 | 2009 |
printed wiring board and method for manufacturing the same | 7 | 2007 |
adhesive resin compositions, and laminates and flexible printed wiring boards using same | 7 | 2009 |
adhesive resin composition, laminate using same, and flexible printed wiring board | 7 | 2009 |
flexible substrate module | 6 | 2010 |
flexible printed wiring board sheet and method for manufacturing the same | 5 | 2008 |
concentrator solar power generation module, concentrator solar power generation panel, a… 🛈 | 5 | 2011 |