The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
bonding wire | 14 | 2007 |
gold alloy wire for ball bonding | 12 | 2007 |
ag-au-pd ternary alloy-based bonding wire | 11 | 2011 |
palladium(pd)-coated copper wire for ball bonding | 11 | 2015 |
gold alloy wire for ball bonding | 10 | 2007 |
bonding wire for high-speed signal line | 10 | 2013 |
silver-gold alloy bonding wire | 10 | 2014 |
coated copper wire for ball bonding | 10 | 2009 |
palladium (pd)-coated copper wire for ball bonding | 9 | 2015 |
noble metal-coated copper wire for ball bonding | 8 | 2015 |