The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
memory module in a package | 38 | 2011 |
high density three-dimensional integrated capacitors | 34 | 2010 |
edge connect wafer level stacking | 30 | 2006 |
microelectronic assembly with impedance controlled wirebond and conductive reference eleā¦ 🛈 | 30 | 2009 |
microelectronic elements with post-assembly planarization | 29 | 2010 |
microelectronic package with terminals on dielectric mass | 23 | 2010 |
stackable molded microelectronic packages | 22 | 2010 |
package-on-package assembly with wire bonds to encapsulation surface | 22 | 2011 |
stacked chip-on-board module with edge connector | 21 | 2011 |
stackable molded microelectronic packages with area array unit connectors | 18 | 2010 |