The report contains ten-year analysis with the following sections
contact us for pricing
Check out our sample pages |
Many companies now available
Search to find companies of interest
read summary of their published patent
the company report contains more information
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
motion monitoring method and device | 9 | 2014 |
electronic package module and method of manufacturing the same | 8 | 2012 |
3d stacked package structure and method of manufacturing the same | 7 | 2012 |
power saving method and control circuitry and power supply | 7 | 2011 |
electronic module and method for same | 7 | 2012 |
stacked substrate structure | 6 | 2012 |
package structure and manufacturing method thereof | 6 | 2012 |
supporting structure and docking station using the same | 6 | 2014 |
chip level emi shielding structure and manufacture method thereof | 5 | 2010 |
method and mask assembly for forming solder bodies on a substrate | 4 | 2007 |