The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
motion monitoring method and device | 9 | 2014 |
elektronisches verpackungsmodul und sein herstellungsverfahren | 8 | 2013 |
electronic package module and method of manufacturing the same | 8 | 2012 |
3d stacked package structure and method of manufacturing the same | 7 | 2012 |
power saving method and control circuitry and power supply | 7 | 2011 |
electronic module and method for same | 7 | 2012 |
package structure and manufacturing method thereof | 6 | 2012 |
stacked substrate structure | 6 | 2012 |
manufacturing method of selective electronic packaging device | 6 | 2014 |
electronic packaged device and manufacturing method thereof | 6 | 2013 |