The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
stack die package | 19 | 2013 |
semiconductor device | 16 | 2009 |
mosfet termination trench | 15 | 2012 |
semiconductor device | 15 | 2009 |
field effect transistor | 14 | 2008 |
split gate semiconductor device with curved gate oxide profile | 14 | 2009 |
a current mode boost converter using slope compensation | 13 | 2007 |
structures of and methods of fabricating trench-gated mis devices | 13 | 2002 |
split gate field effect transistor | 13 | 2009 |
trench polysilicon diode | 13 | 2005 |