The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
package support, fabrication method and led package | 9 | 2014 |
light emitting diode with a current concentrating structure | 7 | 2010 |
surface-mounted light-emitting device and fabrication method thereof | 7 | 2013 |
light emitting diode and fabrication method thereof | 6 | 2015 |
integrated led light-emitting device and fabrication method thereof | 6 | 2013 |
light emitting devices, systems, and methods of manufacturing | 6 | 2011 |
light-emitting diode and fabrication method thereof | 6 | 2013 |
light emitting diode chip and fabrication method | 6 | 2013 |
light emitting device with reflecting electrode | 5 | 2012 |
gallium nitride based light emitting diode with current expanding structure | 5 | 2012 |