The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
ultraviolet cured optic binder | 6 | 2011 |
flowing type chip-grade bottom filling adhesive and preparation method thereof | 4 | 2016 |
hot-pressed adhesive film and preparation method thereof | 2 | 2013 |
liquid optical clear adhesive with low solidification energy and preparation method ther… 🛈 | 2 | 2012 |
pressure-sensitive adhesive and preparation method thereof | 2 | 2012 |
butyl hot melt adhesive and preparation method of butyl hot melt adhesive | 2 | 2012 |
butyl hot melt adhesive tape and preparation method thereof | 2 | 2012 |
liquid optical transparent adhesive with impact resistance and preparation method thereof | 2 | 2012 |
heat conduction cob (chip on board) epoxy adhesive and preparation method thereof | 2 | 2012 |
high elastic corrosion resistant epoxy sealant and preparation method thereof | 2 | 2012 |