The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
rigid-flexible circuit board having flying-tail structure and method for manufacturing s… 🛈 | 7 | 2013 |
drilling method for pcbs with high hole position precision | 5 | 2014 |
method for preparing high salient point solder balls on flip chip substrate at small int… 🛈 | 4 | 2014 |
boss-type metal-based sandwich rigid-flex plate and production method thereof | 4 | 2013 |
packaging substrate resistance welding processing method | 4 | 2015 |
high-speed printed circuit board and difference wiring method therefor | 4 | 2015 |
method for removing film on leadless gilt plate | 4 | 2014 |
electrical performance testing method for multi-material number spliced board | 4 | 2015 |
pcb expansion compensation method | 3 | 2013 |
package substrate single-surface solder resisting plate shape-milling method | 3 | 2014 |