The report contains ten-year analysis with the following sections
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dowa metaltech | 30 |
dowa mining company | 5 |
dowa holdings company | 1 |
dowa metaltech | 32 |
yazaki corporation | 8 |
tokuyama corporation | 2 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated… 🛈 | 14 | 2010 |
substrate with integrated fins and method of manufacturing substrate with integrated fins | 13 | 2010 |
copper alloy sheet material and method for producing same, and current-carrying component | 12 | 2013 |
cu-ni-co-si based copper alloy sheet material and method for producing the same | 12 | 2012 |
cu-ti based copper alloy sheet material and method for producing the same, and electric … 🛈 | 11 | 2013 |
high-strength cu-ni-co-si base copper alloy sheet, process for producing same, and curre… 🛈 | 11 | 2013 |
copper alloy sheet and method for producing same | 11 | 2009 |
mating-type connection terminal, and manufacturing method therefor | 10 | 2011 |
metal-ceramic bonded substrate and method for manufacturing same | 10 | 2011 |
copper alloy plate and method for producing same | 10 | 2008 |