The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
multi-chip module (mcm) power quad flat no-lead (pqfn) semiconductor package utilizing a… 🛈 | 38 | 2010 |
high voltage composite semiconductor device with protection for a low voltage device | 24 | 2011 |
stacked half-bridge package with a common conductive clip | 23 | 2011 |
gallium nitride materials and methods | 22 | 2000 |
integrated dual power converter package having internal driver ic | 16 | 2012 |
normally off iii-nitride semiconductor device having a programmable gate | 16 | 2005 |
stacked composite device including a group iii-v transistor and a group iv vertical tran… 🛈 | 15 | 2011 |
group iii-v device structure having a selectively reduced impurity concentration | 15 | 2011 |
gehäusebaugruppe, dbc-plantine im wafermaßstab und vorrichtung mit einer gehäusebaugrupp… 🛈 | 14 | 2005 |
power semiconductor package | 14 | 2007 |