The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method of bonding a semiconductor device using a compliant bonding structure | 19 | 2009 |
contact for a semiconductor light emitting device | 19 | 2009 |
method of attaching a light emitting device to a support substrate | 18 | 2011 |
iii-nitride light emitting devices grown on templates to reduce strain | 18 | 2006 |
light emitting device with reduced epi stress | 17 | 2010 |
improved p-contact with more uniform injection and lower optical loss | 17 | 2011 |
method of forming a dielectric layer on a semiconductor light emitting device | 17 | 2009 |
method for providing a reflective coating to a substrate for a light-emitting device | 17 | 2011 |
semiconductor light emitting devices grown on composite substrates | 17 | 2008 |
wavelength-converted semiconductor light emitting device | 16 | 2005 |