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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
copper anode or phosphorus-containing copper anode, method for electroplating copper on … 🛈 | 17 | 2007 |
cu-ni-si-co-base copper alloy for electronic material and process for producing the copp… 🛈 | 17 | 2007 |
target formed of sintering-resistant material of high-melting point metal alloy, high-me… 🛈 | 17 | 2007 |
highly pure lanthanum, sputtering target comprising highly pure lanthanum, and metal gat… 🛈 | 16 | 2007 |
composite oxide sinter, process for producing amorphous composite oxide film, amorphous … 🛈 | 15 | 2007 |
nickel alloy sputtering target and nickel silicide film | 14 | 2009 |
metal foil with carrier | 14 | 2008 |
lanthanum target for sputtering | 14 | 2009 |
lanthanum target for sputtering | 14 | 2009 |
sputtering target of nonmagnetic-particle-dispersed ferromagnetic material | 13 | 2008 |