The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
plasma activated conformal film deposition | 59 | 2010 |
control of electrolyte hydrodynamics for efficient mass transfer during electroplating | 24 | 2010 |
apparatus for wetting pretreatment for enhanced damascene metal filling | 24 | 2009 |
methods for depositing ultra thin low resistivity tungsten film for small critical dimen… 🛈 | 23 | 2009 |
depositing tungsten into high aspect ratio features | 21 | 2009 |
lipseals and contact elements for semiconductor electroplating apparatuses | 21 | 2011 |
tungsten feature fill | 19 | 2012 |
purging of porogen from uv cure chamber | 19 | 2005 |
hybrid ceramic showerhead | 18 | 2011 |
method and apparatus for electroplating | 18 | 2006 |