The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
method for estimating carboxylic acid gas concentration, and soldering device | 14 | 2014 |
heat-processing device | 13 | 2012 |
heat-bonding device and heat-bonded-article manufacturing method | 13 | 2013 |
joint manufacturing method | 13 | 2011 |
soldering apparatus and method for manufacturing soldered product | 12 | 2012 |
member laminating device | 11 | 2013 |
heat-bonding device and heat-bonded-article manufacturing method | 11 | 2013 |
electrical bonding method and electrical bonding device | 11 | 2014 |
bonded article manufacturing method and bonded article | 11 | 2014 |
die head and coating liquid application method | 10 | 2013 |