The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
lead-free solder ball | 26 | 2012 |
flux recovery device and soldering device | 26 | 2013 |
solder paste | 23 | 2013 |
lead-free solder alloy | 22 | 2011 |
electrically conductive adhesive agent, joined body, and joint | 22 | 2013 |
solder piece, chip solder and method of fabricating solder piece | 18 | 2011 |
cleaning flux, cleaning solder paste, and solder joint | 17 | 2013 |
lead-free solder alloy and in-vehicle electronic circuit | 17 | 2013 |
lead-free solder ball | 17 | 2011 |
solder paste | 17 | 2011 |