The report contains ten-year analysis with the following sections
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Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
bonding apparatus and method for controlling same | 21 | 2008 |
substrate processing apparatus and substrate processing method | 16 | 2014 |
substrate processing device and substrate processing method | 14 | 2013 |
substrate treatment device and substrate treatment method | 14 | 2010 |
wet etching apparatus | 14 | 2013 |
substrate processing device and substrate processing method | 13 | 2013 |
bonding device and method for manufacturing bonded substrate | 12 | 2013 |
substrate processing device and substrate processing method | 12 | 2013 |
spin processing apparatus and spin processing method | 12 | 2008 |
substrate processing device and substrate processing method | 12 | 2013 |